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News List
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Where
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What
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TBI products
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Others
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When
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* Solderability |
De-wetting** |
No photo / test report |
Yes photo / test report |
05/2002 |
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* Terminal |
Coplanarity |
High |
Low |
05/2001 |
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* Safety |
Distance along surface( L vs.GW terminal) |
+50% longer |
+50% shorter |
05/2001 |
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* Safety |
Because a molded win on rail |
Double |
Half of TBI;s |
05/2001 |
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* Safety |
Apply safety approval |
Easy |
Difficulty |
05/2001 |
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* Plastic |
Expert at |
Thermo-setting plastics |
Thermo-plastics |
11/1998 |
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* Plastic |
Deflection due to heat |
Low |
High |
11/1998 |
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* Plastic |
Impact to coplanarity |
Low |
High |
11/1998 |
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* Plastic |
Broken wire after dip soldering |
Difficult |
Easy |
11/1998 |
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* Plastic |
Therefore, need rework / scrap |
No |
Yes |
11/1998 |
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* SMD bobbin |
Type of terminal other than type GW, C, J, U, P |
L type |
No |
11/2001 |
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* SMD bobbin |
Price ( L vs. GW pin) |
Much less expensive |
High |
11/2001 |
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* SMD bobbin |
Consume size of PCB |
Low |
High |
11/2001 |
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* Header / base |
De-wettibg at tip of terminal ** |
No |
Yes |
11/2001 |
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* Cost of quatity |
Level of implementation |
High |
Low |
05/2001 |
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* Patent |
L type terminal for bobbin |
Yes |
No |
07/2002 |
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* Patent |
Terminal with non flat tip or non elongated tip |
Yes |
No |
04/2000 |
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* Patent |
Benefits to users ( in terms of true cost ) |
High |
No |
04/2000 |
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* Cost |
True cost*** click here |
Low |
High |
11/1998 |
Note - **As a result of comparison between TBI's / competitors' product after aging treatment and solderability test per standards EAI 364-52, IEC 68-2-69, MIL 886, ANSI J STD 002.
- *** Incurred costs relate to quality from ordering material throughout post warrantee.
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