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Where What TBI products Others When
* Solderability De-wetting** No photo / test report Yes photo / test report 05/2002
* Terminal Coplanarity High Low 05/2001
* Safety Distance along surface( L vs.GW terminal) +50% longer +50% shorter 05/2001
* Safety Because a molded win on rail Double Half of TBI;s 05/2001
* Safety Apply safety approval Easy Difficulty 05/2001
* Plastic Expert at Thermo-setting plastics Thermo-plastics 11/1998
* Plastic Deflection due to heat Low High 11/1998
* Plastic Impact to coplanarity Low High 11/1998
* Plastic Broken wire after dip soldering Difficult Easy 11/1998
* Plastic Therefore, need rework / scrap No Yes 11/1998
* SMD bobbin Type of terminal other than type GW, C, J, U, P L type No 11/2001
* SMD bobbin Price ( L vs. GW pin) Much less expensive High 11/2001
* SMD bobbin Consume size of PCB Low High 11/2001
* Header / base De-wettibg at tip of terminal ** No Yes 11/2001
* Cost of quatity Level of implementation High Low 05/2001
* Patent L type terminal for bobbin Yes No 07/2002
* Patent Terminal with non flat tip or non elongated tip Yes No 04/2000
* Patent Benefits to users ( in terms of true cost ) High No 04/2000
* Cost True cost*** click here Low High 11/1998
Note
  • **As a result of comparison between TBI's / competitors' product after aging treatment and solderability test per standards EAI 364-52, IEC 68-2-69, MIL 886, ANSI J STD 002.
  • *** Incurred costs relate to quality from ordering material throughout post warrantee.

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